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ESD CMOS Chip Packing Tray/IC/ESD

 
   
 

ESD IC TRAY/ESD TRAY is made of ESD Macromolecule Polymers, it can supply a safer and more convenient packaging and transporting method for CMOS chips, IC, glass, CSP, optical instruments and other Microelectronics.

JEDEC format, EIAJ format and non-standarded format
Available to inlay the tray together one by one and decrease the processing cost.
Each item with precision mold, and supply with good stability and precision of the space and plane.
With many kinds of select materials to meet the customers’ requirement of ESD and copy.
It’s made, cleaned and packed under clean environment.
Customized design and size are available.


Tel:+86-755-2996 0377ext805     Fax:+86-755-2996 0455            E-mail:sales@bijing.com.cn

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